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笔试题(physical design)

10-16 00:00:09 来源:http://www.qz26.com 笔试题目   阅读:8656
导读:physical design1.before tape-out,which routine check should be performed for your layout database in 0.18 um process?a.drcb.lvsc.drc&antennae.simulation2.how to fix antenna effect?a.make the wire wider and shorterb.change lower metal to upper metalc.connect with diode of metal and diffusiond.change upper metal to lower metale.b&c3.please expain lvsa.logic versus schematicb.layout versus schematicc.layout via synthesisd.logic via synthesis4.how to control c
笔试题(physical design),标签:银行笔试题目,企业笔试题目,http://www.qz26.com

physical design

1.before tape-out,which routine check should be performed for your layout database in 0.18 um process?
a.drc
b.lvs
c.drc&antenna
e.simulation
2.how to fix antenna effect?
a.make the wire wider and shorter
b.change lower metal to upper metal
c.connect with diode of metal and diffusion
d.change upper metal to lower metal
e.b&c
3.please expain lvs
a.logic versus schematic
b.layout versus schematic
c.layout via synthesis
d.logic via synthesis
4.how to control clock skew?
a.get balanced clock tree
b.decrease the fanout
c.add clock buffer evenly
d.decrease clock latency
5.how to avoid hold_time violation?
a.lower the clock speed
b.the clock arrive later
c.the clock arrive earlier
d.the data arrive later
e.the data arrive earlier
6.what kinds of factors reflect good floor plan?
a.easy routing
b.easy timing met
c.enough power supply
d.a&b
e.a&b&c www.qz26.com
7.what cause cell delay?
a.input-pin transition time
b.output-pin capacitance.
c.output-pin resistance
d.a&b
e.b&c
8.why need i/o pads for each chip?
a.esd protection
b.voltage level shift
c.latch-up prevention
d.a&c
e.a&b&c
9.which one is worse-case in 0.18um process?
1.1.8v,25c
2.1.98v,125c
3.1.62v,-40c
4.1.62v,125c
5.1.98v,-40c
10.if power plan is not good,what’ll happen to the chip?
a.hot-spot
b.voltage drop
c.timing not met
d.routing is tough
e.all of above


Tag:笔试题目银行笔试题目,企业笔试题目求职笔试面试 - 笔试题目
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